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Features
* * * * * * *
Active Mixer with Conversion Gain No External LO Driver Necessary Low LO Drive Level Required RF and LO Ports May Be Driven Single-ended Single 5-V Supply Voltage High LO-RF Isolation Broadband Resistive 50-W Impedances on All Three Ports
Applications
* Infrastructure Digital Communication Systems * 1700 MHz to 2300 MHz Receivers for CDMA/PCS/DCS/UMTS Base Stations Electrostatic sensitive device. Observe precautions for handling.
1700 - 2300 MHz High Linearity SiGe Active Receiver Mixer T0781
Description
The T0781 is a high linearity active mixer which is manufactured using Atmel's advanced Silicon-Germanium technology. This mixer features a frequency range of 1700 MHz to 2300 MHz. It operates from a single 5-V supply and provides 12 dB of conversion gain while requiring only 0 dBm input to the integrated LO driver. An IF amplifier is also included. The T0781 incorporates internal matching on each RF, IF and LO ports to enhance ease of use and to reduce the external components required. The RF and LO inputs can be driven differentially or single-ended.
Preliminary
Figure 1. Block Diagram
RFP RFN
4 5 1 16 13
IFP IFN
LOP 12 LON
Rev. 4534A-SIGE-09/02
1
Pin Configuration
Figure 2. Pinning SSOP16
IFP VCC GND RFP RFN GND VCC L1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 IFN VCC GND LOP LON GND VCC L2
Pin Description
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol IFP VCC GND RFP RFN GND VCC L1 L2 VCC GND LON LOP GND VCC IFN Function IF positive output 5-V power supply Ground RF positive input RF negative input Ground 5-V power supply External inductor terminal External inductor terminal 5-V power supply Ground Local oscillator, negative input Local oscillator, positive input Ground 5-V power supply IF negative output
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Absolute Maximum Ratings (1)
All voltages are referred to GND.
Parameters Supply voltage LO input IF input Operating temperature Storage temperature Notes: Symbol VCC LOP, LON RFP, RFN TOP Tstg Value 5.5 10 15 -40 to +85 -65 to +150 Unit V dBm V C C
1. The device may not survive all maximum values applied simultaneously.
Thermal Resistance
Parameters Junction ambient Junction case Symbol RthJA RthJC Value TBD 46 Unit K/W C/W
Electrical Characteristics
Test Conditions: VCC = 5 V, Tamb = 25C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
Test Conditions For RF = 2000 to 2300 MHz operation, single-ended RF + LO drive is recommended 1700 to 2000 MHz Operation Pin 4, 5 Symbol fRF Min. 1700 Typ. Max. 2000 2000 to 2300 MHz Operation Min. 2000 Typ. Max. 2300 Unit MHz Type* B, C
No. 1 1.1
Parameters AC Performance RF frequency range
1.11 1.2 1.3
LO frequency range IF frequency range Input IP3 RF1 = RF2 = -15 dBm/tone, 1 MHz spacing 1, 16 4, 5
fLO FIF IIP3
1400 30 12 200 15
2000 300
1700 30 12 200 15
2300 300
MHz MHz dBm
B, C B, C D
1.4 1.5
Input P1dB Conversion gain
4, 5 1, 16
P1dB G
1 9
2 12
3 6
5 9
dBm dB
D A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The return losses shown were measured with the T0781 mounted on Atmel's FR4 evaluation boards using standard matching practices as indicated on the respective application schematic (see Figure 23 and Figure 24). Users following the RF, LO and IF matching guidelines will achieve similar performance.
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Electrical Characteristics (Continued)
Test Conditions: VCC = 5 V, Tamb = 25C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
Test Conditions 1700 to 2000 MHz Operation Pin 1, 16 Matched to 50 W (1) Matched to 50 W (1) Matched to 50 W (1) Matched to 50 W 4, 5 12, 13 1, 16 12, 13 12, 13 12, 13 Symbol NFSSB RLRF RLLO RLIF PLO -3 Min. Typ. 14 20 20 20 0 +3 -3 Max. 15 2000 to 2300 MHz Operation Min. Typ. 16 20 20 20 0 +3 Max. 19 Unit dB dB dB dB dBm Type* D D D D D
No. 1.6 1.7 1.8 1.9 1.10 2 2.1 2.2 2.3 3 3.1
Parameters SSB noise figure RF return loss LO return loss IF return loss LO drive
Isolation Performance Leakage (LO-RF) Leakage (LO-IF) Leakage (RF-IF) Miscellaneous Supply voltage 2, 7, 10, 15 2, 7, 10, 15 VCC 4.75 5.0 5.25 4.75 5.0 5.25 V A ALO-RF ALO-IF -60 -30 -53 -40 -20 -40 -30 -30 -35 -20 -20 -25 dBm dBm dBm D D D
3.2
Supply current
ICC
160
180
160
180
mA
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The return losses shown were measured with the T0781 mounted on Atmel's FR4 evaluation boards using standard matching practices as indicated on the respective application schematic (see Figure 23 and Figure 24). Users following the RF, LO and IF matching guidelines will achieve similar performance.
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1700 MHz to 2000 MHz: Typical Device Performance
Figure 3. Conversion Gain Versus Temperature, PLO = 0 dBm
Conversion Gain vs Tem perature Plo = 0dBm
20.0 Conversion Gain (dB) 16.0 12.0 8.0 4.0 0.0 1400
-40C +25C +85C 1600 1800 2000 Frequency (MHz) 2200
Figure 4. Conversion Gain Versus LO Drive, Tamb = 25C
Conversion Gain vs LO Drive T=+25C 20.0 Conversion Gain (dB) 16.0 12.0 8.0 4.0 0.0 1400 -3 dBm 0 dBm +3 dBm 1600 1800 2000 Frequency (MHz) 2200
Figure 5. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25C
Leakages Plo=0 dBm at pins, Prf=-20 dBm at pins, T=+25C 0 Leakage (dBm) -20 -40 -60 -80 1400 LO-RF RF-IF LO-IF
1600
1800 2000 Frequency (MHz)
2200
5
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Figure 6. Input IP3 Versus Temperature PLO = 0 dBm
Input IP3 vs Tem perature Plo = 0dBm 20.0 Input IP3 (dBm) 18.0 16.0 14.0 12.0 10.0 1700 -40C +25 C +85 C
1750
1800
1850
1900
1950
2000
Frequency (MHz)
Figure 7. Input IP3 Versus LO Drive, Tamb = 25C
Input IP3 vs LO Drive T=+25C 20.0 Input IP3 (dBm) 18.0 16.0 14.0 12.0 10.0 1700 -3 dBm 0 dBm +3dBm
1750
1800 1850 1900 Frequency (MHz)
1950
2000
Figure 8. Noise Figure Versus Temperature, PLO = 0 dBm
Noise Figure vs Tem perature Plo=0dBm 20 Noise Figure (dB) 18 16 14 12 10 1700 -40C +25C +85C
1750
1800
1850
1900
1950
2000
Frequency (MHz)
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Figure 9. RF & LO Return Loss, Tamb = 25C
RF & LO Return Loss (Note 1) T=+25C 0 Return Loss (dB) -5 -10 -15 -20 -25 -30 1400 1600 1800 2000 Frequency (MHz) 2200 RF RL LO RL
Figure 10. IF Return Loss, Tamb = 25C
IF Return Loss (Note 1) T=+25C 0 -5 Reutrn Loss (dB) -10 -15 -20 -25 -30 30 60 90 120 150 180 210 240 270 300 Frequency (MHz)
Figure 11. Input P1dB Versus Temperature, PLO = 0 dBm
Input P1dB vs Tem perature Plo=0 dBm 5.0 Input P1dB (dBm) 3.0 1.0 -1.0 -3.0 -5.0 1700 -40C +25 C +85 C 1750 1800 1850 1900 1950 2000
Frequency (MHz)
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Figure 12. Input P1dB Versus LO Drive, Tamb = 25C
Input P1dB vs LO Drive T=+25C 5.0 Input P1dB (dBm) 3.0 1.0 -1.0 -3.0 -5.0 1700 -3 dBm 0 dBm +3dBm 1750 1800 1850 1900 1950 2000
Frequency (MHz)
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2200 MHz to 2300 MHz: Typical Device Performance, Single-ended Drive
Figure 13. Conversion Gain Versus Temperature, PLO = 0 dBm
Conversion Gain vs Tem perature Plo=0 dBm 20 Conversion Gain (dB) 16 12 8 4 0 2000 -40C +25C +85C
2100
2200
2300
2400
2500
Frequency (MHz)
Figure 14. Conversion Gain Versus LO Drive, Tamb = 25C
Conversion Gain vs LO Drive T=+25C 20 Conversion Gain (dB) 16 12 8 4 0 2000 -3 dBm 0 dBm +3 dBm
2100
2200
2300
2400
2500
Frequency (MHz)
Figure 15. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25C
Leakages Plo=0 dBm at pins, Prf=-20 dBm at pins, T=+25C LO-RF RF-IF LO-IF
-20 Leakage (dBm) -25 -30 -35 -40
-45 1800
1900 2000 2100
2200
2300 2400 2500
Frequency (MHz)
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Figure 16. Input IP3 Versus Temperature PLO = 0 dBm
Input IP3 vs Tem perature Plo=0dBm 20.0 Input IP3 (dBm) 18.0 16.0 14.0 12.0 10.0 2000 -40C +25C +85C
2050
2100 2150 2200 Frequency (MHz)
2250
2300
Figure 17. Input IP3 Versus LO Drive, Tamb = 25C
Input IP3 vs LO Drive T=+25C 20.0 Input IP3 (dBm) 18.0 16.0 14.0 12.0 10.0 2000 -3 dBm 0 dBm +3 dBm
2050
2100 2150 2200 Frequency (MHz)
2250
2300
Figure 18. Input P1dB Versus Temperature, Tamb = 25C
Input P1dB vs Tem perature Plo=0dBm 10.0 Input P1dB (dBm) 8.0 6.0 4.0 2.0 0.0 2000 -40C +25C +85C
2050
2100
2150
2200
2250
2300
Frequency (MHz)
10
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Figure 19. RF & LO Return Loss, VCC = 5 V, Tamb = 25C
RF & LO Return Loss (Note 1) Vcc=5V, T=+25C 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 1800 1900 2000 2100 2200 2300 2400 RF RL LO RL
Frequency (MHz)
Figure 20. IF Return Loss, Tamb = 25C
IF Return Loss (Note 1) T=25C 0 Reutrn Loss (dB) -5 -10 -15 -20 -25 -30 30 75 120 165 210 255 300 Frequency (MHz)
Figure 21. Input P1dB Versus Temperature, PLO = 0 dBm
Input P1dB vs Tem perature Plo=0dBm 10.0 Input P1dB (dBm) 8.0 6.0 4.0 2.0 0.0 2000 -40C +25C +85C
2050
2100
2150
2200
2250
2300
Frequency (MHz)
11
4534A-SIGE-09/02
Figure 22. Input P1dB Versus LO Drive, Tamb = 25C
Input P1dB vs LO Drive T=25C 10.0 Input P1dB (dBm) 8.0 6.0 4.0 2.0 0.0 2000 -3 dBm 0 dBm +3 dBm
2050
2100
2150
2200
2250
2300
Frequency (MHz)
Figure 23. 1700 MHz to 2000 MHz Application Schematic (Differential Drive)
5V
IFout J5 Lfil
Vcc Vcc
RFin J3
C3
C7 1 2 3 4 5 6 7 8 L1
T2 IC1 16 15 14 13 12 11 10 9
C9
C1
Vcc
L4 C11 C12 T11 J4 LOin
T9
C4 L3 C5
Vcc
C20
T0781
Vcc
C21 L2
Vcc
C6
Vcc
C10
12
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Bill of Materials (for 1700 MHz to 2000 MHz Evaluation Board)
Component Designator IC1 J3, J4, J5 T9, T11 T2 Lfil L1, L2 L3 L4 C1, C3, C20, C21 C6, C10 C7, C9 C4, C5 C11, C12 1:1 1:1 1 H see Table 1 18 nH 15 nH 6.8 pF 100 pF 120 pF 2.2 pF 3.3 pF Value Vendor Atmel Johnson Components Panansonic Mini-Circuits Wurth Elektronik TOKO TOKO TOKO Part Number T0781 142-0701-851 EHF-FD1619 TC1-1 74476401 LL1608-FSR10J LL1608-FS18NJ LL1608-FS15NJ Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Description SiGe receiver mixer SMA connector, end launch with tab, for 0.062 inch board RF transformer IF transformer Inductor, 1210 footprint, minimum 200 mA rating Inductor, 0603 footprint, high Q series Inductor, 0603 footprint, high Q series
The T0781 utilizes an IF tank circuit to maximize performance across the entire IF bandwidth. the off-chip inductors L1 and L2 resonate with an on-chip capacitor (4 pF) to provide IF tunability. therefore, L1 and L2 must be selected such that the resonance occurs at the desired IF. The following table provides the inductor values required on the evaluation board for some common intermediate frequencies. By default, all evaluation board are shipped with L1 = L2 = 100 nH, resulting in a 200 MHz resonant IF. Table 1. IF Tank Circuit
IF (MHz) Typical 70 150 200 300 L1, L2 (nH) 680 150 100 39 TOKO Part Number LL2012-FHR68J LL1608-FSR15J LL1608-FSR10J LL1608-FS39NJ
The following procedure may be used to ensure that the proper inductor values have been selected for a given IF. 1. Prepare the evaluation board for a conversion gain measurement by using the "General Test Set-up". 2. Enable the "Max Hold" function on the spectrum analyzer and set the "SPAN" to 200 MHz. 3. Vary the LO frequency while maintaining a consonant input frequency. 4. The resonant will be observed at the peak of the response.
13
4534A-SIGE-09/02
Figure 24. Demo Test Board (Fully Asembled PCB)
J5
47 mm
T9 C4 C7 C3 L3
T2 C9 IC1
T0781
C1 L4
C11
T11
J3
C5 C20 L1 C6 C10
C12 C21 L2
J4
Lfil CON 2 1
47 mm
14
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Figure 25. 2000 MHz to 2300 MHz Application Schematic (Single-ended Drive)
5V
IFout J5 Lfil
Vcc
C3 R1 RFin J3 L3 C5
C7
Vcc
C4
Vcc
C20 L1
IC 1 1 2 3 4 5 6 7 8
T2 C9 16 15 14 13 12 11 10 9 L2 C1
Vcc
C11 R2 L4 C12 J4 LOin
T0781
Vcc
C21
Vcc
C6
Vcc
C10
Bill of Materials for (2000 MHz to 2300 MHz Evaluation Board)
Component Designator IC1 J3, J4, J5 T2 Lfil L1, L2 L3, L4 C1, C3, C20, C21 C6, C10 C7, C9 C4, C5 C11 C12 R1, R2 1:1 1 H see Table 1 6.8 nH 6.8 pF 100 pF 120 pF 2.2 pF 3.3 pF 2.7 pF 0 Value Vendor Atmel Johnson Components Mini-Circuits Wurth Elektronik TOKO TOKO Part Number T0781 142-0701-851 TC1-1 74476401 LL1608-FSR10J Description SiGe receiver mixer SMA connector, end launch with tab, for 0.062 inch board IF transformer Inductor, 1210 footprint, minimum 200 mA rating Inductor, 0603 footprint, high Q series Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Capacitor, 0603 footprint Resistor, 0603 footprint
LL1608-FSR8NJ Inductor, 0603 footprint, high Q series
15
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Figure 26. Demo Test Board (Fully Asembled PCB)
J5
47 mm
T2 C7 C3 C9 IC1
T0781 T0780
C4 R1
C1 R3 R4 C21 L2 C10
C11 C12
J3
C5 R2 C20 L1 C6
J4
Lfil CON 2 1
47 mm
Figure 27. Recommended Package Footprint In order to avoid soldering problems, plugging of the ground vias under the heat slug is recommended!
31.75
6.35 0.74 0.4 3.0 0.74
3.0
f0.33 via
0.7
0.9
6.9
all units are in mm - Indicates metalization - vias connect pad to underlying ground plane Remark: Heatslug must be soldered to GND.
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Ordering Information
Extended Type Number T0781-6C Package TSSOP16 Remarks -
Package Information
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4534A-SIGE-09/02
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4534A-SIGE-09/02 xM

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